PCB Interconnect Defects: Why Inner Layers Separate
PCB Interconnect Defects are separations at or near the connection between an inner-layer copper feature and the metallization inside a […]
PCB Interconnect Defects are separations at or near the connection between an inner-layer copper feature and the metallization inside a […]
PCB Barrel Cracks are fractures in the copper wall of a via or plated-through hole. A cracked barrel may pass
PCB Plating Voids are unplated or inadequately plated areas within a via or plated-through-hole wall. Inspectors should not accept or
PCB Plating Uniformity describes how consistently a manufacturer deposits copper across a production panel, between different circuit areas, and through
PCB Copper Thieving is nonfunctional copper that a PCB manufacturer adds to low-density areas to improve plating distribution, etching consistency,
PCB copper balance does not require every layer to have the same copper percentage. Instead, the design should avoid copper
PCB dimensional stability describes how accurately PCB materials and copper patterns retain their X-Y dimensions during etching, oxide treatment, lamination,
PCB layer registration is acceptable only when the relative position of copper layers, drilled holes, and other features leaves enough
PCB trace width tolerance has no single value that applies to every circuit board. The acceptable variation depends on the
PCB etch factor describes the relationship between vertical copper removal and sideways undercut during PCB etching. It helps explain why